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Sizzix Tool, Die Brush & Foam Pad For Wafer Thin Dies
Sizzix Tool, Die Brush & Foam Pad For Wafer Thin Dies

Sizzix Tool, Die Brush & Foam Pad For Wafer Thin Dies

660513
Vendor
Sizzix
Regular price
$14.99
Sale price
$14.99

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut!

The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

@jejelfass